3D Memory Chip Architect and Design

Join an innovative semiconductor organization developing next-generation compute and memory technologies. This is a highly influential Principal-level role where you’ll help define new 3D memory architectures, evaluate complex system-level tradeoffs, and shape technologies that could power future AI platforms.

Who you are:

• Deep expertise in memory architecture and computer architecture, including DRAM, FLASH, memory management, coherency, consistency, virtualization, and/or memory controllers.
• Experience architecting advanced memory systems for AI, HPC, server, mobile, or other high-performance compute platforms.
• Strong understanding of ARM, RISC-V, or similar processor architectures and heterogeneous compute systems.
• Experience with architectural modeling, workload/performance analysis, and system-level optimization.
• Strong understanding of memory bandwidth, latency, power, thermal, density, and performance tradeoffs.
• Proficiency in C/C++ and/or Python for architectural modeling and analysis.
• Must be located in the U.S. and authorized to work in the U.S. without sponsorship.

What you’ll do:

• Define and optimize next-generation 3D DRAM/FLASH organizations and near-memory compute architectures.
• Explore new approaches to increasing memory bandwidth, density, performance, and energy efficiency for AI workloads.
• Model and evaluate tradeoffs across performance, power, latency, thermal constraints, yield, manufacturability, and scalability.
• Architect high-bandwidth memory fabrics and power distribution strategies across complex 3D memory stacks.
• Evaluate emerging memory technologies and determine how they can be incorporated into future compute architectures.
• Collaborate with AI, SoC, memory controller, packaging, silicon, and performance teams to shape next-generation computing platforms.

Why work here:

• Significant architectural ownership and influence over future AI and memory technologies.
• Opportunity to help define new 3D memory architectures rather than simply execute against an existing roadmap.
• Solve complex challenges across memory bandwidth, AI performance, power, thermal, packaging, and 3D integration.
• Work alongside senior architects and engineering leaders across multiple technical disciplines.
• Highly competitive compensation package including base salary, annual bonus, RSUs, and comprehensive benefits.